Schematic package for an F50 notebook, 1.01 MB in RAR format, for platform IGL50 with code 0731, probably a date, on motherboard LA-3371P. The LA-xxxxP number follows the Compal pattern, meaning Compal designed and built the board as ODM. Technicians use this material to follow power sequencing, trace signals and identify components when diagnosing no-power or short faults. Verify that the LA-3371P marking and revision on the PCB match the document, since Compal frequently issues several revisions of one design.
The button opens the matching file on RM Schematics, or a source page if it is not catalogued there yet. The original attachment is from @IT_SERVICE_WORLD. Enginerys does not host this file.
All sources (2)
The same file was posted more than once. If one link is dead, try the next.
| Channel | Posted | |
|---|---|---|
| @IT_SERVICE_WORLD | 1 Oct 2019 | Open file on RM Schematics |
| @IT_SERVICE_WORLD | 2 May 2021 | Open file on RM Schematics |
How to open a .rar file
Compressed archive — the usual wrapper for a schematic + boardview pair or a BIOS + EC set.