- Name Type Board Source Added Size
- SM BIOS 11.21.51.1458 COR H BA PRD RGN
Clean Management Engine region at version 11.21.51.1458 for the Corporate firmware branch on H chipsets, stepping BA, production build.
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 11.21.50.1451 COR H BA PRD RGN
Release 11.21.50.1451 of Intel ME firmware, Corporate SKU, H-series chipset, stepping BA, production signed and delivered as an RGN clean region. The image is 6.01 MB.
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 11.21.50.1429 COR H BA PRD RGN
ME region binary, build 11.21.50.1429, in the Corporate configuration for H chipsets at BA stepping, production quality and clean (RGN).
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 11.21.50.1424 COR H BA PRD RGN
Production Intel ME firmware region, version 11.21.50.1424, Corporate SKU, H-series PCH, stepping BA.
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 11.21.50.1400 COR H BA PRD RGN
Clean ME region of firmware 11.21.50.1400, intended for Corporate SKU systems with an H chipset at BA stepping, production signed.
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 11.20.0.1302 COR H B PRD RGN
Intel ME region at version 11.20.0.1302, Corporate firmware for H chipsets, stepping B, production build, supplied as a clean RGN image.
BIOS · 6.01 MB · 3 Oct 2025BIOS bin—6.01 MB - SM BIOS 13.0.0.1085 CON LP D PRD EXTR
Management Engine firmware version 13.0.0.1085, Consumer SKU (CON) for LP chipsets, stepping D, production signed.
BIOS · 3.26 MB · 3 Oct 2025BIOS bin—3.26 MB - SM BIOS 13.0.0.1082 CON LP D PRD EXTR
Extracted Intel ME region, build 13.0.0.1082, Consumer edition for low-power LP chipsets at D stepping, production.
BIOS · 3.27 MB · 3 Oct 2025BIOS bin—3.27 MB - SM BIOS 13.0.0.1066 CON LP D PRD EXTR
ME firmware 13.0.0.1066 for the Consumer SKU on LP chipsets, stepping D, production signed and extracted (EXTR) from an existing image.
BIOS · 3.26 MB · 3 Oct 2025BIOS bin—3.26 MB - SM BIOS 13.50.20.1657 ATM N A PRD EXTR
Intel ME firmware region versioned 13.50.20.1657, marked ATM N, stepping A, production, extracted (EXTR) from a firmware image.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.50.15.1436 ATM N A PRD RGN
Clean RGN region of Management Engine firmware 13.50.15.1436, tagged ATM N with stepping A and production signing.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.50.11.1304 ATM N A PRD EXTR
ME region build 13.50.11.1304 from the ATM N line, stepping A, production, extracted from an existing firmware.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.50.10.1274 ATM N A PRD RGN
Stock Management Engine region, version 13.50.10.1274, platform code ATM N, stepping A, production build supplied as a clean RGN image.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.50.10.1252 ATM N A PRD RGN
Intel ME firmware 13.50.10.1252 as a clean RGN region, ATM N variant, stepping A, production signed. It is an earlier build than 13.50.10.1274 in the same branch.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.50.0.1189 ATM N A PRD EXTR
Extracted ME region at version 13.50.0.1189, the base release of the 13.50 branch in this set, tagged ATM N, stepping A, production. Size is 2.81 MB.
BIOS · 2.81 MB · 3 Oct 2025BIOS bin—2.81 MB - SM BIOS 13.30.30.1766 LIT LP B SPI PRD EXTR
Management Engine firmware 13.30.30.1766 with the tokens LIT LP, stepping B, SPI, production signed and extracted from an existing image.
BIOS · 2.99 MB · 3 Oct 2025BIOS bin—2.99 MB - SM BIOS 11.8.80.3746 SLM LP C NPDM PRD EXTR
ME firmware version 11.8.80.3746 for the Slim SKU (SLM) on LP chipsets, stepping C, NPDM variant, production signed and extracted from a firmware image.
BIOS · 1.00 MB · 3 Oct 2025BIOS bin—1.00 MB - SM BIOS 11.8.80.3746 SLM H DA PRD EXTR
Extracted Intel ME region, build 11.8.80.3746, Slim SKU for H-series chipsets, stepping DA, production.
BIOS · 1.00 MB · 3 Oct 2025BIOS bin—1.00 MB - SM BIOS 11.8.80.3746 COR LP C NPDM PRD RGN
Clean Corporate ME region of version 11.8.80.3746 for LP chipsets, stepping C, NPDM variant, production signed, provided as an RGN stock image.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.80.3746 COR H DA PRD RGN
ME firmware 11.8.80.3746, Corporate SKU for H-series chipsets, stepping DA, production build, supplied as a clean RGN region.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.80.3746 CON LP C NPDM PRD RGN
Stock Consumer ME region, version 11.8.80.3746, for LP chipsets at stepping C, NPDM variant, production signed, provided as a clean RGN file.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.80.3746 CON H DA PRD RGN
Intel Management Engine firmware image, version 11.8.80.3746, despite the BIOS label in its name.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.79.3722 COR LP C YPDM PRD RGN
Corporate ME firmware region at version 11.8.79.3722 for the LP platform, C stepping, the mobile U/Y chipset family.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.79.3722 COR LP C NPDM PRD RGN
Stock Intel ME region, Corporate edition 11.8.79.3722, built for the LP (low-power mobile) chipset at C stepping.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.79.3722 COR H DA PRD RGN
Corporate ME firmware 11.8.79.3722 for H-series desktop and high-performance mobile chipsets, D/A stepping, packaged as a clean production region.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.79.3722 CON LP C YPDM PRD RGN
Consumer-grade Intel ME region, build 11.8.79.3722, aimed at LP chipsets at C stepping with Power Down Mitigation enabled (YPDM).
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.6.11.1199 CON LP C NPDM PRD RGN
Intel ME region image at 11.6.11.1199, Consumer build for the LP mobile chipset, C stepping, non-PDM variant.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.6.10.3197 COR H DA PRD RGN
Stock Corporate ME firmware, version 11.6.10.3197, targeting H-series chipsets at D/A stepping.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.6.10.1196 COR LP C NPDM PRD RGN
Management Engine region from the 11.6.10.1196 release, Corporate SKU, LP chipset C stepping, without Power Down Mitigation.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.6.10.1196 COR H DA PRD RGN
Corporate ME firmware 11.6.10.1196 for H-series PCH, D/A stepping, in its stock production region form at 7.01 MB.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.6.10.1196 CON LP C NPDM PRD RGN
Consumer Intel ME region at version 11.6.10.1196 for LP chipsets, C stepping, non-PDM. Production firmware in clean RGN form, 1.94 MB, without board-specific…
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.6.10.1196 CON H DA PRD RGN
Clean Consumer ME firmware 11.6.10.1196 for H-series chipsets at D/A stepping, provided as a production region of 1.94 MB.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.55.3510 COR LP C NPDM PRD RGN
Intel ME region, Corporate edition 11.8.55.3510, for the LP mobile chipset at C stepping and without Power Down Mitigation.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.55.3510 COR H DA PRD RGN
Corporate Management Engine firmware, version 11.8.55.3510, for H-series chipsets at D/A stepping.
BIOS · 7.01 MB · 3 Oct 2025BIOS bin—7.01 MB - SM BIOS 11.8.55.3510 CON LP C YPDM PRD RGN
Consumer ME firmware 11.8.55.3510 built for LP chipsets at C stepping, PDM-enabled variant. Supplied as a clean production region of 1.94 MB.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.55.3510 CON LP C NPDM PRD RGN
Stock Intel ME region version 11.8.55.3510, Consumer SKU, LP mobile chipset at C stepping, non-PDM.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.55.3510 CON H DA PRD RGN
Consumer ME firmware for H-series chipsets, D/A stepping, at version 11.8.55.3510, in clean production region form of 1.94 MB.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.55.3502 CON LP C NPDM PRD EXTR
ME firmware region at 11.8.55.3502, Consumer edition for LP chipsets, C stepping, non-PDM.
BIOS · 2.00 MB · 3 Oct 2025BIOS bin—2.00 MB - SM BIOS 11.8.50.3474 CON LP C NPDM PRD EXTR
Extracted Consumer ME region, version 11.8.50.3474, for the LP mobile chipset, C stepping, non-PDM variant.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB - SM BIOS 11.8.50.3460 CON LP C NPDM PRD RGN
Production ME region at 11.8.50.3460, Consumer SKU for LP chipsets, C stepping, without Power Down Mitigation.
BIOS · 1.94 MB · 3 Oct 2025BIOS bin—1.94 MB