Duplicate copy of a ProDesk 400 G3 Microtower BIOS image, firmware N03 version 02.11, targeted at a 16 MB flash chip, in a 5.61 MB ZIP.

BIOS backup archive for the HP ProBook x360 11 G2 EE convertible, with the name citing board 6050A290880 and marking the dump as working.

Another copy of the HP ProDesk 400 G3 Microtower firmware, version N03 02.11, made for a 16 MB SPI chip and stored in a ZIP of 5.61 MB.

Firmware dump from a Micron N25Q064A flash chip, saved on 7 January 2020 and packed into a 3.01 MB RAR file.

Early Intel ME 11.6.1.1142 firmware build, Corporate SKU for LP chipsets, C stepping, NPDM meaning no Power Down Mitigation. Production RGN region of 6.01 MB.

Intel Management Engine firmware 11.6.11.1199, Consumer SKU for LP chipsets at C stepping, NPDM build without Power Down Mitigation.

BIOS image for the Xiaomi Mi Notebook Pro 14 A34 on a Tiger Lake platform with 11th-generation CPU, board 203027-1, with the code 448.0MW03.0011, intended for a 16 MB…

Early Consumer release 11.6.0.1110 of Intel ME for PCH-LP mobile chipsets, C stepping, tagged YPDM, meaning the Power Down Mitigation variant, production signed.

Release 11.6.0.1121 of the Consumer Intel Management Engine, built for PCH-LP mobile chipsets at C stepping, NPDM type, production signed, as a clean 1.94 MB RGN region.

Corporate ME firmware 11.6.10.1196 for H-series PCH, D/A stepping, in its stock production region form at 7.01 MB.

Intel Management Engine 11.6.0.1126, Consumer build for low-power PCH-LP chipsets, C stepping, NPDM (without Power Down Mitigation), production.

Firmware dump for the HP 288 Pro G6 Microtower desktop, from a board marked M11 KENT revision A.

ME firmware region at version 11.11.65.1590, Consumer SKU for H chipsets, A letter, production build, delivered as a 1.75 MB RGN image.

Clean Management Engine region at version 11.21.51.1458 for the Corporate firmware branch on H chipsets, stepping BA, production build.

Release 11.8.78.3681 of Intel ME, Consumer SKU for low-power PCH-LP chipsets, C stepping, NPDM with no Power Down Mitigation, production signed.

Production ME region at 11.8.50.3460, Consumer SKU for LP chipsets, C stepping, without Power Down Mitigation.

Corporate Intel Management Engine 11.6.0.1117 for low-power PCH-LP platforms, C stepping, NPDM without Power Down Mitigation, production release.

Intel ME 11.8.79.3722, Consumer SKU for PCH-LP chipsets, C stepping, NPDM with no Power Down Mitigation, production release.

Management Engine region from the 11.6.10.1196 release, Corporate SKU, LP chipset C stepping, without Power Down Mitigation.

Consumer Intel ME 11.6.10.1196 for the LP chipset family, C stepping, NPDM variant without Power Down Mitigation.

Raw 32 MB SPI flash read taken from an XM25QH256B chip in a SOIC16 300-mil package, labelled for Compal board LA-J261P and carrying the token fdx40, likely a project…

Intel ME 11.6.10.1196, Corporate branch for low-power LP chipsets, C stepping, without Power Down Mitigation (NPDM). Production signed stock region, 6.01 MB.

Raw read of a Micron N25Q032A SPI flash chip, timestamped 7 January 2020, in a 2.83 MB RAR archive.

Corporate SKU Intel ME 11.6.0.1121 for the PCH-LP platform, C stepping, NPDM variant with no Power Down Mitigation, production build.

An 8 MB BIOS image for the Intel DIB75R, codenamed Pine Valley, with board reference 11061-1 and 3GX01 in the name, supplied as a ZIP of 5.02 MB.

BIOS archive for the HP ProBook 4441s, Rocky Intel platform, motherboard 11243-1. Numbers in this five-digit style follow Wistron board numbering, Wistron being the ODM…

Consumer ME firmware 11.8.55.3510 built for LP chipsets at C stepping, PDM-enabled variant. Supplied as a clean production region of 1.94 MB.

Intel ME 11.6.12.1201 firmware, Corporate SKU, for LP chipsets at C stepping, NPDM (no Power Down Mitigation).

Production module 300.2.11.1020 for the Cannon Point H platform controller hub, stepping B.

Firmware file tagged with version 7.0.4.1197 and nothing else, a 1.49 MB binary. Model, board number and chip type are not part of the name, so the image must be…

Consumer Intel ME firmware, version 11.6.29.3287, aimed at PCH-LP mobile platforms, C stepping, NPDM variant (no Power Down Mitigation), production signed.

RAR archive marked as an original main BIOS dump for an X1 board numbered 11246-2, a Wistron-pattern project code, 5.06 MB in size.

Consumer ME firmware for LP PCH, version 11.8.65.3590, stepping C, production, clean RGN image in the NPDM variant without Power Down Mitigation.

Corporate Intel ME firmware version 11.8.50.3434 for the LP chipset, C stepping, and notably the YPDM variant, meaning Power Down Mitigation is included.

BIOS binary for the Wistron-made board 11289-1, labelled as having a cleaned Management Engine region and reported as tested working.

Firmware dump for the Samsung UE55MU6400U television, assembly BN94-11958G, panel CY-KM055HGEV1V, read from a W25Q40CL SPI flash.

Intel ME 11.8.56.3522, Consumer SKU for LP chipsets at C stepping, NPDM build without Power Down Mitigation, as a clean 1.75 MB production region.

16 MB raw read of a GigaDevice GD25Q128B flash chip in a WSON8 package, timestamped 11 April 2024 at 11:25:41 by the programmer software.

Consumer Intel CSME firmware, version 11.8.77.3664, for LP chipsets with C stepping code and Power Down Mitigation enabled (YPDM).

Corporate Intel ME firmware 11.8.65.3590 for LP PCH, stepping C, production, provided as a clean RGN region in the NPDM variant without Power Down Mitigation.