Service manual archive for the Samsung Galaxy J2 (2016), model SM-J210F, sized 4.98 MB in ZIP format.

Schematics and service manual for the Samsung SM-J510FN, the Galaxy J5 (2016) model variant, supplied as a 13.4 MB RAR archive.

Schematic in PDF form for the Samsung Galaxy Tab 4 10.1 3G, model SM-T531, a 1.40 MB document covering the tablet's mainboard circuitry.

BIOS dump for the ASUS X540MAR motherboard at revision 3.1, distributed as a 5.70 MB RAR.

BIOS dump package for the HP EliteBook 830 G5, motherboard 6050A2930901-MB-A01, an Inventec design going by the 6050A numbering.

BIOS dump for the HP EliteBook 840 G5, board 6050A2945601-MB-A01, archived as a 9.14 MB RAR.

Dell Latitude 3420 BIOS dump for Wistron board 213105-2. The clr tag in the name most likely means a cleared image, but what was cleared is not stated.

Corporate CSME firmware, version 15.0.41.2142, for LP chipsets at stepping B, production extracted, with a -Y flag that is not explained.

Consumer firmware for H-series chipsets, B stepping, version 15.0.35.1951, production and extracted, 2.98 MB.

Stock Corporate CSME region, version 15.0.30.1716, for the H platform at A stepping, production build, labelled RGN, which typically denotes a clean region image rather…

Consumer (Con) Intel ME firmware, version 16.1.25.1932, for LP mobile chipsets at A stepping, 3.75 MB. It is a Management Engine region image, not a full BIOS.

Production Corporate Intel CSME firmware, version 16.1.25.1932, for H-series chipsets at A stepping, extracted from an OEM BIOS (EXTR). The file is 8.62 MB.

Consumer Intel ME 11.8.60.3561 region image for LP chipsets, stepping C, production build. The NPDM tag marks the variant without PDM, as opposed to YPDM builds.

Consumer ME firmware version 11.8.56.3522 for low-power LP chipsets, stepping C, without PDM (NPDM), as a stock production region image of 1.94 MB.

Corporate Intel ME 11.8.55.3510 for LP chipsets, stepping C, in the YPDM variant, as opposed to NPDM builds. It is a clean production region (RGN) of 7.01 MB.

Corporate Intel ME firmware, version 16.0.15.1735, for LP PCH, stepping A, production, extracted from an existing dump with an added -Y suffix.

Corporate ME firmware for H-series PCH, release 16.0.15.1735, stepping A, production, taken from an existing image (EXTR) with a -Y suffix.

Clean RGN region, 1.94 MB, of Consumer Intel Management Engine 11.8.79.3722 for PCH-H platforms with the DA stepping tag and production keys.

Stock 7.01 MB RGN of Intel ME 11.8.78.3681, Corporate SKU for PCH-LP platforms at C stepping, NPDM without Power Down Mitigation, production signed.

Intel ME firmware 11.8.78.3681, Corporate flavor for PCH-H chipsets with DA stepping, production keys, delivered as a clean 7.01 MB RGN region.

Stock Corporate ME firmware, version 11.6.10.3197, targeting H-series chipsets at D/A stepping.

Consumer ME firmware 11.8.55.3510 built for LP chipsets at C stepping, PDM-enabled variant. Supplied as a clean production region of 1.94 MB.

Stock Intel ME region version 11.8.55.3510, Consumer SKU, LP mobile chipset at C stepping, non-PDM.

Clean Consumer ME firmware 11.8.50.3460 for H-series chipsets at D/A stepping, 1.94 MB production region.

Intel ME 11.6.12.1201 firmware, Corporate SKU, for LP chipsets at C stepping, NPDM (no Power Down Mitigation).

Slim (SLM) SKU Intel ME firmware version 11.8.55.3510 for H-series chipsets, DA stepping, production signed and extracted (EXTR), 1.00 MB.

Intel ME firmware 11.8.50.3474, Consumer edition for H-series PCH at D/A stepping, provided as a 1.75 MB region extracted from a dump.

Schematic in PDF form for the NK70SBSE board, delivered in a 7.42 MB ZIP; the name gives the board code but no brand or revision.

Schematic for the P65xHP6 platform with the P650HP6-G model referenced, provided as PDF in a 9.03 MB ZIP archive.

Binary firmware image of exactly 8 MB with an uninformative name that gives no brand, model or board number.

Schematic in PDF for the Hasee Z6 laptop, built on the Clevo N850HJ / N850HJ1 platform, with board number N850HJMB-0D and the Hasee model code Z6-KP5S1 in the name.

Service manual for the Haier HL32D2 and HL42XD2 LCD televisions, a 4.79 MB PDF containing schematic diagrams for the sets.

Huawei G700-U10 circuit diagram in PDF form, about 2.16 MB. The U10 suffix identifies the specific variant named in the file, so make sure your handset carries the same…

Schematic package for the Samsung Galaxy S21 Plus, model SM-G996B, supplied as a ZIP archive of about 4.86 MB.

Service manual archive for the Samsung Galaxy J2 (2018), model SM-J250N, 8.37 MB in RAR format.

Service manual archive for the Samsung Galaxy J2 (2018), covering model SM-J250F along with the M and G variants listed in the name.

Schematic page for the 13 MP wide main rear camera of the Samsung SM-A02S, provided as a 3.71 MB PDF.

Firmware binary labelled SM_BIOS version 1.0.5.1099, 3MB layout, with MD, PRD and EXTR tags, and a file size of 2.31 MB.

Region image from the SM_BIOS family at version 1.0.4.1090, tagged 3MB, MD, PRD and RGN, with an actual size of 2.31 MB.

SM_BIOS binary, version 1.0.4.1089, of the 3MB layout and carrying MD, PRD and RGN markers; size is 2.31 MB.