ZIP archive for Compal board LA-D751P, revision 1.0, with BAP10 as the project code in the name; contents are not listed, so it may contain a schematic, boardview or…

Compressed package for the Huawei G9, roughly 5.14 MB as a RAR archive; the name states the model alone and does not list what is included.

Service archive for the ASUS X550L and X550LC notebooks, revision 2.0 board, compressed into a 3.06 MB ZIP.

RAR archive of about 1.8 MB for the Toshiba Satellite A200, tied to the Inventec Milwaukee 10 board project.

RAR archive of 1.10 MB for the N55SF mainboard, with MB meaning motherboard and 2.0 most likely indicating board revision 2.0.

Archive for the Lenovo IdeaPad U350 ultraportable, 1.54 MB in RAR format. The name says nothing about its contents, ODM or board number, so open it to see whether it…

RAR archive for the Lenovo ThinkPad SL410, 1.94 MB, with no ODM, board number or revision mentioned in the name.

Archive for the HP Compaq NX6310 and NX6320 business laptops, which the name labels as Presario, with the code AX2, likely the board project name.

Archive for the VA30-HM platform, Wistron board 13334-1 with revision code 02B17, packed in a 1.49 MB ZIP.

Archive of 4.13 MB named HPC-S-MV-MB-V3, where MB most likely refers to a motherboard and V3 to a version or revision.

Compal mainboard LA-9535P at revision 1.0, platform code Z5WE1, supplied as a 4.84 MB ZIP archive.

Zipped boardview for the ASUS PRIME H410M-F desktop motherboard, revision 1.01, supplied in the ASC format noted in the name.

ZIP archive for the ASUS K42JR notebook, board revision 3.0. The name does not list the contents, which may include a schematic, boardview or firmware for this model, so…

Repair archive for the ASUS FX505DY laptop, board revision 2.1, in a 23.6 MB ZIP. The name does not list the contents, so expect some mix of schematic, boardview or…

Archive for the Compal motherboard GLMS1, numbered LA-K321P, revision 1B, dated 2020-08-17.

First part, labelled (1), of a K30 PRO collection in a 7z archive of roughly 373 KB, with no brand recorded in the data.

RAR archive of 1.40 MB for an Apple MacBook Air built on logic board 820-00165-A, labelled with the J113 project code.

RAR archive for the HP 290 G2 desktop with board number 17514-1, revision A, 6.26 MB in size.

Layout package for the ASUS H81M-C R2.0 motherboard, file revision 1.00D, in a 150 KB RAR archive.

ASUS H81M-CT motherboard archive, revision 1.00A, 154 KB in RAR format. The name does not describe what is inside, though ASUS packages of this size usually contain…

Another copy of the Samsung SGH-F700V package, a ZIP archive of 4.53 MB with a doubled copy suffix in the name.

Duplicate-named ZIP archive for the Samsung Galaxy A7 (2017), model SM-A720F, 1.57 MB in size.

Archive in RAR format, 875 KB, tied to the ECS mainboard model P23G, with the same size as the other P23G copy in the index.

Samsung Galaxy J5 service material for model SM-J500H, delivered as a 6.55 MB RAR archive.

Archive for the Samsung Galaxy J7 Core smartphone model SM-J701F, board revision 0.2, 211 KB in RAR format.

Repair archive for the Apple iPhone 7 Plus, packed as a ZIP of 9.95 MB. The name offers nothing beyond the model, so check the contents, which in packs like this are…

Archive for the Xiaomi Mi 9T Pro, sold in some markets as the Redmi K20 Pro, packed as a 1.01 MB zip.

RAR archive, 877 KB, for the Xiaomi Mi 5S Plus, the larger sibling of the Mi 5S. The file name lists the model alone, so the document type inside is unconfirmed and…

Xiaomi Mi 2S repair archive, 932 KB in RAR form. The file name names the phone model and nothing else, so the type of documentation inside is not stated and must be…

RAR archive of 15.9 MB for the Samsung Galaxy J2 Prime, model SM-G532G. The file name does not list its contents, which in repair packs of this kind are usually service…

RAR archive of 1.03 MB covering the Xiaomi Mi CC9 and Mi CC9 Pro, with the document type not specified in the name.

Samsung Galaxy Note 4 archive for model SM-N910F, sized 6.05 MB in ZIP format. The name specifies only the handset, so contents need confirming after extraction; repair…

ZIP archive of 7.75 MB for the Samsung Galaxy J7 2017, model SM-J730FM. The file name lists only the device and model code, so examine the files inside to find out…

Archive for the Samsung Galaxy J2, model SM-J200H, packed as ZIP at roughly 5.46 MB. The name gives only the model, so the actual files inside, whether schematics…

RAR archive of 845 KB for the Samsung Corby, model GT-B3210, the QWERTY slider variant of the Corby range.

Huawei Ascend G330D, model code U8825D, supplied as a RAR archive of 1.09 MB. The file name lists only the phone, not the document type, so extract with WinRAR or 7-Zip…

Archive of 203 KB titled P5KPL-SE, an ASUS desktop board model, in RAR format with no further detail in the name about whether it holds a boardview, schematic or…

Archive for the ASUS P5G41T-M LX3, a G41 chipset micro-ATX motherboard, stored as a 289 KB RAR file; the name does not reveal the file type or revision.

RAR archive of 1.12 MB with documentation for the BenQ JoyBook A52E, based on the Quanta AK2 motherboard, revision 1A.

Archive for the Dell Precision M4010 tied to board number 09940-1, a pattern that follows Wistron numbering, so Wistron is the likely ODM behind the motherboard.