Dell Latitude 5400 firmware archive for Compal board LA-G891P, platform code EDC41, revision 1.0 A00 dated 2019-03-28.

Packed as RAR (6.32 MB), this is Intel Flash Image Tool version 12.0.70.1652. FIT belongs to Intel's ME System Tools and is what technicians use to rebuild an SPI flash…

ZIP archive for the Samsung Galaxy S6 edge plus, 4.77 MB. The name shows only the model, so the content type must be checked after extracting; repair packages for this…

Schematic archive for the HP Pavilion dv4 and Compaq Presario CQ40, built on the Compal LA-4117P motherboard, revision 0.3, with the document dated 16 March 2009.

Photo archive for the Huawei Honor MagicBook Pro 16.1 with Ryzen 7, Quanta project H97A, board DAH97AMBAD0, packed in a 19.3 MB RAR file.

Small 344 KB ZIP for the Huawei Ascend G630, whose name holds only the phone model and a numeric suffix.

Huawei Honor 5X service archive, 6.82 MB ZIP, named only by the handset and a numeric timestamp, so the documents inside are not described.

ZIP archive of 1.49 MB for the Samsung Galaxy S7 edge. No document type or model code appears in the name, so the contents should be checked after extraction; for this…

Samsung Galaxy S9 Plus service archive, 10.4 MB in ZIP format, labelled only with the model and a numeric timestamp.

Samsung Galaxy J4 documentation archive, 4.05 MB, compressed as ZIP and named only by model with a numeric string attached.

Archive for the Dell Latitude E7450, Compal platform ZBU10 on board LA-A961P revision 1.0 (A00), dated 2014-10-16 and marked tested OK.

Galaxy A6 Plus repair archive from Samsung, 10.9 MB in ZIP format, whose name gives only the model and a long numeric suffix.

Repair archive covering the Samsung Galaxy J6 2018, ZIP of 4.04 MB. The file name names only the phone, not the document type, so open it to confirm whether schematics…

Archive for the Samsung Galaxy A3 2017, 3.29 MB in ZIP form, whose name identifies the phone and nothing else apart from a numeric string.

Repair package for the Samsung Galaxy S9, a 7.05 MB ZIP whose name lists only the model and a numeric timestamp.

Galaxy J7 Core documentation bundle from Samsung, 2.78 MB packed as ZIP, with a name carrying only the model and a numeric suffix.

Repair material for the Samsung Galaxy A5 2017 handset, supplied as a 7.77 MB ZIP archive.

Service archive for the Samsung J7 Prime, a 4.65 MB ZIP whose name lists the model and nothing else.

Samsung Galaxy A5 2018 archive, 3.69 MB in ZIP format, named only by model plus a numeric string, so the file types inside are unknown until it is opened.

Galaxy Note 8 repair archive from Samsung, delivered as a 3.44 MB ZIP. The name gives just the model, leaving the document type, board revision and regional variant…

ZIP archive of 4.57 MB for the Samsung Galaxy J7 Prime 2, identified in the name only by model and a numeric suffix.

ZIP archive of roughly 6.08 MB for the Samsung Galaxy J4 Plus smartphone. Apart from the model, the name says nothing about what is inside, so it may be schematic pages…

Samsung J5 Prime smartphone material packed into a 3.01 MB ZIP archive. Apart from the model, the name gives no detail about the document type, board revision or…

ZIP archive of about 4.83 MB for the Samsung Galaxy S8 Plus. The name identifies only the phone, without a document type, board number or chipset variant, so the actual…

ZIP archive for the Samsung Galaxy J7 Pro, 3.11 MB, with no indication in the name of what documents are inside beyond the model and a long numeric suffix.

ZIP archive of about 5.86 MB for the Samsung Galaxy A6 2018 phone. Only the model and year appear in the name, so the archive could hold a schematic, a component…

Samsung Galaxy J8 repair archive packed as a ZIP of about 3.95 MB. The name gives only the phone model, so whether it holds a schematic, a boardview, a service layout or…

A small 2.76 MB ZIP archive, catalogued under Samsung and labelled only Note 9, which points to the Galaxy Note 9 smartphone.