Intel 430TX material in a 631 KB RAR file, relating to the last Intel chipset for Socket 7 Pentium and Pentium MMX processors.

Repair guide archive for the Huawei Y9 smartphone covering a power button or key fault.

Intel 875P package of about 8.98 MB in RAR form, relating to the Canterwood-generation 875P chipset for Pentium 4 with dual-channel DDR.

Samsung E700H archive of about 15.4 MB, with no description of its contents beyond the model.

ZIP archive for the ASUS K56CM notebook, where the shortened Repa token likely refers to repair material, though the exact contents are not spelled out.

Intel Model 440BX documentation bundled as a 577 KB RAR file, tied to the popular 440BX chipset used with Pentium II and III processors.

Intel 875P chipset material packed into a 9.03 MB RAR archive. The 875P, known as Canterwood, served high-end Pentium 4 desktops; the name gives no revision or file…

Conversion details for the Sony VAIO MBX-270 mainboard, a 14.2 MB archive that presumably documents the DIS to UMA modification for this board.

Huawei Y320 package of 2.53 MB whose name gives nothing beyond the model number, so its exact contents are unknown until extracted.

Intel 845 documentation in a 782 KB RAR archive, labelled as a model 845 design, which refers to the Intel 845 chipset family for Pentium 4 processors.

RAR archive of 12.8 MB named only P6, without a brand or content description. The token may point to a phone such as a Huawei P6, but the name does not confirm the…

Small archive of measurement references for laptop motherboards, apparently from an NB_parts collection.

RAR archive of 417 KB labelled as an hk9 conversion, most likely a guide for converting a board with a discrete graphics section to integrated (UMA) operation, although…

Service documentation for the LG K130F phone, packed into an 18.5 MB RAR. LG SVC manuals normally include disassembly steps, troubleshooting guides, block and circuit…

Troubleshooting archive for the Samsung I9500, the Galaxy S4, compressed as a RAR of about 16.4 MB.

Reference archive on diagnosing and locating faults behind iPhone restart problems, such as boot loops and random reboots.

Repair guide archive covering the LCD backlight circuit of the Xiaomi Redmi Note 8 Pro, spelled Redmo in the name.

Intel 860 chipset documentation at revision 1.2 in a 6.68 MB RAR archive. The 860 platform supported dual Xeon processors with RDRAM, so the material is mainly relevant…

Zip archive of about 3.60 MB whose Russian title translates to starting the IMVP8 VRM on the GX502LXS, part one, prepared by DeaZz.

Compressed RAR package named as service manuals for RT51, a code that the name does not tie to any particular brand or product.

RAR archive of 2.14 MB for the TCL 32E5200 LED television. The file name holds only the brand and model, so the type of contents, whether firmware, schematic or service…

Lenovo service documentation in a 12.3 MB RAR archive. Judging by the name, it is the English Hardware Maintenance Manual for the ThinkPad T420s and T420si, document…

RAR archive for the Samsung SM-J500H, the Galaxy J5 variant of that model code, about 6.55 MB in size.

iPhone 11 reference archive listing important supply resistance values for the BB side, which in repair notation usually means the baseband board section.

Repair guide archive for the Oppo A9 2020 covering no network or weak signal faults, 352 KB in RAR format.

Repair reference pack for the Apple iPhone 11 Pro addressing a no signal fault, packed as a RAR archive of about 5 MB.

Intel 82850 documentation at revision 3.0, delivered as a 6.43 MB RAR archive. The 82850 is the memory controller hub of the Intel 850 chipset for Pentium 4 with RDRAM…

MSI MS-7177 archive, compressed with RAR, 3.01 MB in size. Only the board number is stated, so it is unclear whether you will find a schematic, boardview, BIOS dump or a…

Test-point and component map for the OPPO R9 smartphone board, packed as a 264 KB RAR. The name gives no board revision, so compare the layout with the actual PCB before…

Quick-start guide for Samsung Auto Backup version 2.0, stored as a 1.01 MB RAR archive.

Small 344 KB ZIP for the Huawei Ascend G630, whose name holds only the phone model and a numeric suffix.

Repair guide for audio faults on the Huawei Enjoy 5S, also known as the GR3, supplied as a 225 KB RAR archive.

RAR archive of 7.73 MB with disassembly material for the Huawei MediaPad 10 tablet, going by the name, which spells the word Disaassembly.

Archive for the W510TU, likely the Clevo model, with the ESM suffix suggesting service manual material, 6.11 MB in RAR format.

Troubleshooting archive for the Samsung SM-J260G smartphone, labelled Common Tshoo 7, about 1.3 MB.

Samsung Galaxy SM-M205F troubleshooting material packed as RAR, about 3.8 MB, named Common Tshoo 7.

Conversion pack for the Dell 5110, likely the Inspiron N5110, at 13.1 MB, a size that suggests it contains photos, schematic extracts and possibly a BIOS image.

Service archive for the Honor Play smartphone from Huawei, packed as a 2.32 MB RAR. The name only identifies the device and says nothing about the document type, so open…

Intel 860 chipset material at revision 1.2, compressed into a 6.64 MB RAR file; the 860 targeted dual Xeon workstations with RDRAM memory.

Galaxy J3 (2017) service manual for the SM-J3308 and SM-J3300 models, archived as a 9.38 MB ZIP.