RAR archive named for Compal board LA-J701P, marked OK and revision 2.0, but only 154 bytes in size.

Full schematic for the Samsung SM-J701F smartphone, the Galaxy J7 Neo model, prepared in Spanish and supplied as a 6.47 MB PDF.

Boardview for the Compal LS-J701P, revision 0.1, archived as an 838 KB rar file. In Compal numbering the LS prefix normally marks a daughterboard, such as an I/O, USB or…

J701MT root tar for binary U7 running Android 9, roughly 20.1 MB. Packages in Odin format are flashed in download mode and normally replace the boot partition with a…

Lenovo laptop firmware for a Realtek RTS5457U Type-C PD controller on Compal board LA-J701P. The archive holds the code image, identified by CRC32 0xA0511C47.

Schematic PDF of 2.88 MB named only j701, which gives no brand, model or board revision.

Schematic PDF of 2.88 MB whose name gives only j701, with no brand stated in the record; it likely relates to a J7 series handset, but the exact device should be…

Schematic diagram for the Samsung Galaxy J7 Neo SM-J701M, packaged as a 1.32 MB PDF. It lets a technician trace the battery and charging circuit, PMIC outputs, display…

PDF schematic named j701, 2.88 MB, with no brand recorded in the listing. The name is brief and does not confirm the exact device, so the content should be checked to…

Magisk-based root archive for the J701F, built for Android 9 on binary U7, stored as a 19.9 MB file with a doubled tar extension.

Circuit diagram in PDF for Compal motherboard LA-J701P, revision 1.0 (R10), packed in a 5.67 MB RAR archive.

Archive for the Samsung Galaxy J7 Core smartphone model SM-J701F, board revision 0.2, 211 KB in RAR format.

Compal LA-J701P schematic at revision R10, provided as a 1.1 MB PDF. The name does not state the laptop brand or model, so identify the target machine by the board…

BIOS image for the FLMA0 platform on Compal board LA-J701P revision 1.0, with a date of 2020-01-15 in the name.

Compal LA-J701P motherboard boardview, revision 1.0, supplied as an 11.1 MB rar archive.

BIOS dump for a laptop board numbered LA-J701P, revision 3.0, labelled with the FLMAO project code and dated 2020-12-25, described as fully working.

Schematic in PDF form, archived as a 3.14 MB RAR, for an L360 laptop design on an AMD platform, listing Compal board numbers LA-K971P and LA-J701P at revision 2.0.

Firmware dump for a Lenovo laptop on Compal board LA-J701P, with project code FLMAO and a date of 10 June 2020, marked as working.

Working firmware image for the Compal LA-J701P mainboard, revision 2.0, tagged FLMAO and dated 2020-06-10.

Compal LA-J701P revision 1.0 BIOS dump carrying the FLMAO code and the 2020-01-15 date, marked as working without reservation.

BIOS for the LA-J701P board at revision 1.0, FLMAO platform, dated 2020-01-15, with the name specifying a 16MB image and claiming it is fully working.

Schematic in PDF form for the Compal LA-K971P board, revision 0.3, dated 2021-02-04, carrying the L360 project name and a customer release label; the index also links…

Galaxy J7 Core documentation bundle from Samsung, 2.78 MB packed as ZIP, with a name carrying only the model and a numeric suffix.