Unlocked 32 MB flash dump from the main board of a device labelled x9t, read from a GigaDevice GD25Q256C in an SOP16 package and timestamped in its name.

Huawei Honor 5X service archive, 6.82 MB ZIP, named only by the handset and a numeric timestamp, so the documents inside are not described.

Original 32 MB flash read from the main board of a device labelled x9t, taken from a GigaDevice GD25Q256C chip in an SOP16 package, with a date and time stamp in the…

ZIP archive of 1.49 MB for the Samsung Galaxy S7 edge. No document type or model code appears in the name, so the contents should be checked after extraction; for this…

Samsung Galaxy S9 Plus service archive, 10.4 MB in ZIP format, labelled only with the model and a numeric timestamp.

Samsung Galaxy J4 documentation archive, 4.05 MB, compressed as ZIP and named only by model with a numeric string attached.

Small two-byte file recording the status register of a GigaDevice GD25LQ128 flash, saved during a read on 18 December 2018. No device or board is named.

Galaxy A6 Plus repair archive from Samsung, 10.9 MB in ZIP format, whose name gives only the model and a long numeric suffix.

BIOS dump for a board identified as AT-7000, revision 1.2, read from a Winbond W25Q64 flash chip, which holds 64 Mbit or 8 MB; the name also carries a timestamp from 30…

Repair archive covering the Samsung Galaxy J6 2018, ZIP of 4.04 MB. The file name names only the phone, not the document type, so open it to confirm whether schematics…

Archive for the Samsung Galaxy A3 2017, 3.29 MB in ZIP form, whose name identifies the phone and nothing else apart from a numeric string.

Repair package for the Samsung Galaxy S9, a 7.05 MB ZIP whose name lists only the model and a numeric timestamp.

Galaxy J7 Core documentation bundle from Samsung, 2.78 MB packed as ZIP, with a name carrying only the model and a numeric suffix.

Repair material for the Samsung Galaxy A5 2017 handset, supplied as a 7.77 MB ZIP archive.

Service archive for the Samsung J7 Prime, a 4.65 MB ZIP whose name lists the model and nothing else.

Samsung Galaxy A5 2018 archive, 3.69 MB in ZIP format, named only by model plus a numeric string, so the file types inside are unknown until it is opened.

Galaxy Note 8 repair archive from Samsung, delivered as a 3.44 MB ZIP. The name gives just the model, leaving the document type, board revision and regional variant…

ZIP archive of 4.57 MB for the Samsung Galaxy J7 Prime 2, identified in the name only by model and a numeric suffix.

ZIP archive of roughly 6.08 MB for the Samsung Galaxy J4 Plus smartphone. Apart from the model, the name says nothing about what is inside, so it may be schematic pages…

Samsung J5 Prime smartphone material packed into a 3.01 MB ZIP archive. Apart from the model, the name gives no detail about the document type, board revision or…

ZIP archive of about 4.83 MB for the Samsung Galaxy S8 Plus. The name identifies only the phone, without a document type, board number or chipset variant, so the actual…

ZIP archive for the Samsung Galaxy J7 Pro, 3.11 MB, with no indication in the name of what documents are inside beyond the model and a long numeric suffix.

ZIP archive of about 5.86 MB for the Samsung Galaxy A6 2018 phone. Only the model and year appear in the name, so the archive could hold a schematic, a component…

Samsung Galaxy J8 repair archive packed as a ZIP of about 3.95 MB. The name gives only the phone model, so whether it holds a schematic, a boardview, a service layout or…

Samsung Galaxy J5 Pro service archive, a 4.62 MB ZIP whose name gives only the phone model and a numeric timestamp, so the exact contents are not stated.

A small 2.76 MB ZIP archive, catalogued under Samsung and labelled only Note 9, which points to the Galaxy Note 9 smartphone.

Filed under schematics, a 164 KB PDF named 2N6387 with an RE suffix that the name does not explain.

A 164 KB PDF dedicated to the 2SD1221, recorded as a schematic in the catalogue. Japanese JIS numbering uses the 2SD prefix for NPN bipolar transistors in low-frequency…

2.1 channel hi-fi audio amplifier circuit by Technical Mriganka, a 164 KB PDF. The title does not name the amplifier ICs or output devices, so identify them from the…

A 164 KB PDF catalogued as a schematic and titled 28C64B, the B revision of the 28C64 64 Kbit parallel EEPROM code. The name names no vendor or package.

PDF of 164 KB catalogued as a schematic and named 28F020 with a trailing underscore, which usually marks an alternate copy of the same part document, possibly from a…

Zipped boardview for the Compal LA-E541P motherboard, with R10-011 and A0 given in the name, likely referring to revision or build markings. The archive is 164 KB.

Boardview for the ASUS PU301LA mainboard, revision 2.0, contained in a 164 KB RAR file; BDV marks the boardview type.

Boardview for the ASUS M2N4 SLI motherboard, revision 1.02G, provided as a 164 KB RAR. The layout shows component positions, designators and net links.

PDF component document of 164 KB for the 23c010 part. Within the common 23C naming scheme this denotes a mask ROM, with 010 typically standing for 1 Mbit, though the…

PDF datasheet, 164 KB, for the PG12032ERU-BNN-B graphic LCD module, a variant within the PG12032 line with its own option code for backlight and display mode.

Compact 164 KB PDF datasheet covering the PH320240A graphic LCD module, whose part number points to a 320 x 240 pixel resolution.

Datasheet for the SN74164N, an 8-bit serial-in, parallel-out shift register in the 74-series TTL logic family, with the N suffix denoting the plastic DIP package.