Production ME region at 11.8.50.3460, Consumer SKU for LP chipsets, C stepping, without Power Down Mitigation.

Corporate Intel ME firmware 11.6.12.1201 for H chipsets with DA stepping, production build, 6.01 MB.

Firmware archive labelled with version 14.1.67.2046, with suffix tokens CON, LP, BA, PRD and EXTR.

Small 4 KB Intel firmware component for the TGP (Tiger Point) platform, version 15.0.0.1021, production build.

Production firmware module for Intel Jasper Lake systems, indicated by the JSP prefix, version 135.3.00.1031, with N and A tokens that likely point to the N-series PCH…

Ice Point PCH firmware module for Intel Ice Lake designs, version 9.0.2.0001, N variant, production signed going by the PRD tag.

Earliest of the listed Ice Point N-variant modules, version 9.0.1.0009, a production build for Intel Ice Lake systems.

ICP LP firmware component, release 130.1.30.1043 with D designation, intended for Intel Ice Lake platforms and built for production.

Earliest of the 4 KB ICP binaries here, version 13.0.0.1002, a production build for Intel Ice Lake platforms.

Intel Cannon Point firmware build 300.2.11.1018 for the H-type chipset, stepping B, marked PRD for production.

A 4 KB Intel firmware module labelled CMP, version 14.5.0.1001, production build. CMP generally refers to the Comet Point chipset family, and the version format suggests…

Consumer Intel ME firmware, version 16.0.15.1662, for LP mobile chipsets, A stepping, production build.

Corporate-SKU Intel CSME region, version 15.0.42.2235, LP PCH, stepping B, production, extracted with a -Y suffix and AFE0C0FC tag. Size 9.67 MB.

Corporate SKU Intel CSME region at version 15.0.10.1414 for LP chipsets with stepping B, production firmware, distributed as a stock RGN image and tagged 947414E4…

Boardview package for the Lenovo IdeaPad 330S, labeled ARR with V06 and the MP revision marker, MP usually meaning mass-production board.

Boardview for Apple logic board 820-01521, the PJJ MLB, marked as a Pre-EVT2 engineering stage, compressed to 140 KB in rar.

Stock Corporate CSME region, version 15.0.30.1716, for the H platform at A stepping, production build, labelled RGN, which typically denotes a clean region image rather…

Consumer ME firmware version 11.8.56.3522 for low-power LP chipsets, stepping C, without PDM (NPDM), as a stock production region image of 1.94 MB.

Stock Corporate ME firmware, version 11.6.10.3197, targeting H-series chipsets at D/A stepping.

Stock Intel ME region version 11.8.55.3510, Consumer SKU, LP mobile chipset at C stepping, non-PDM.

Slim (SLM) SKU Intel ME firmware version 11.8.55.3510 for H-series chipsets, DA stepping, production signed and extracted (EXTR), 1.00 MB.

Version 15.0.0.1014 of a 4 KB production firmware module for the Intel TGP chipset family, an earlier release than the 1021 build of the same series.

Firmware module for Intel LKF (Lakefield), S series, version 10.227.203.1145, production build, 44 KB.

Firmware component for Intel Cannon Point, H variant, B stepping, version 300.2.11.1021, production signed build.

Early production build of a BXT (Broxton) firmware module, version 0.1.0.0, revision C, dated 2016-07-21.

Intel CSME 16.0.15.1735 Consumer image for H-series PCH platforms, A stepping, production signed, extracted, 3.00 MB.

Intel CSME firmware 15.40.10.2252, SVR variant, LP PCH, stepping B, SPI, production, provided as a 3.09 MB RGN region.

Intel ME firmware 15.0.35.2028 in Corporate configuration for H-series chipsets, stepping B, production release.

Management Engine Corporate firmware, version 15.0.23.1706, built for the H PCH at stepping A, production signed, extracted copy of about 9.90 MB.

Clean regional (RGN) image of Intel CSME 14.5.12.1111, Consumer SKU, V variant, PCH stepping A, production signed, 2.95 MB.

Boardview archive for a board labelled S150I GL SVT MB, Wistron number 19705-1M with code 0JB03, supplied in BDV and CAD formats.

Collection of schematic diagrams for the Xiaomi Mi 5S, supplied as a 1.81 MB ZIP archive.

Schematic archive for Compal board LA-5081P, revision 1.0, size 1.43 MB in RAR format. Revision 1.0 generally represents the production design.

Raw binary named only by a version string, 10.0.30.1072, with 1.5MB, PRD and RGN tokens; these match the naming of Intel Management Engine firmware region images, here a…

Intel CSME firmware region, version 14.1.77.2497, which appears to be the Consumer SKU for LP (mobile) chipsets, as a production build extracted from a full image.

Corporate firmware, version 15.0.30.1902, for an H-series chipset in A stepping, an extracted production build with an unexplained -Y suffix, 9.90 MB.

Production (PRD) build 150.1.20.1018 of a TGP-platform firmware module for the LP chipset variant at stepping C, 148 KB in size.

Small 24 KB production firmware module tagged CMP_P, version 12.14.214.2014. CMP usually denotes Intel's Comet Point chipset family used with Comet Lake, and the P token…

Consumer Intel CSME 16.0.15.1620 for LP mobile PCH, A stepping, production firmware. The RGN tag typically indicates a stock ME region rather than an extracted update.

Intel Management Engine firmware image, version 16.0.15.1545, Consumer SKU for H-series PCH, stepping A, production build, supplied as an RGN file.