A 4 KB production binary tied to Intel Jasper Lake, per the JSP code, labelled version 13.5.0.1009.

Firmware component for the Intel Cannon Point LP chipset, version 300.1.20.1030, stepping C, production release.

BIOS binary of 8 MB for the Compal LA-L241P board, a new build with the Intel Management Engine region cleaned.

Firmware image for the HP 15-bs579TX, a model fitted per the name with a sixth generation Intel Core i3, provided as an 8 MB raw .bin.

An 8 MB BIOS binary tagged as ASUS, but the file name JYTUT gives no model or board number, so it is uninformative on its own.

Raw binary BIOS or firmware dump with an uninformative name, ZQS, that identifies no brand, model or board number.

Receiver software for the 1X1 model, Super edition, in a 3.58 MB binary tagged SW-1. Apart from the model and edition, the name provides no firmware version or release…

Chi Mei N165B6-L06 panel EDID, revision C1, stored as a 256-byte binary. The image holds the descriptor that informs the laptop's video output of the panel's native…

Second variant of the EDID for the AU Optronics B141EW04 revision V4, a 128-byte binary for a 14.1-inch notebook panel.

Binary image identified solely by the version 7.1.52.1176, with nothing in the name about the laptop model, brand or motherboard.

Raw binary version 9.5.14.1724, 1.49 MB, without any device name or board number in its name.

Firmware image for the Intel D945GCCR motherboard, a 512 KB binary intended for the board's BIOS flash memory.

Fourth variant in a set of HP 655 AMD firmware files, roughly 4.38 MB in size. That size does not match a common SPI chip capacity, so the file may be an update image or…

Working BIOS dump for the Samsung NP700Z5A, board code NIKE15-QC with BBY marking and Samsung part number BA41-01724A, labelled as tested OK.

Corporate LP firmware labelled CorLP, version 15.0.47.2473, for TGP-LP B stepping chipsets, 9.39 MB in size.

Corporate firmware, version 15.0.30.1902, for an H-series chipset in A stepping, an extracted production build with an unexplained -Y suffix, 9.90 MB.

Production (PRD) build 150.1.20.1018 of a TGP-platform firmware module for the LP chipset variant at stepping C, 148 KB in size.

Small 24 KB production firmware module tagged CMP_P, version 12.14.214.2014. CMP usually denotes Intel's Comet Point chipset family used with Comet Lake, and the P token…

Consumer Intel CSME 16.0.15.1620 for LP mobile PCH, A stepping, production firmware. The RGN tag typically indicates a stock ME region rather than an extracted update.

Intel Management Engine firmware image, version 16.0.15.1545, Consumer SKU for H-series PCH, stepping A, production build, supplied as an RGN file.

Intel ME firmware, Consumer edition 15.0.23.1777, targeting H-series PCH at stepping A, production signed, extracted copy of 3.36 MB.

Consumer CSME firmware version 15.0.22.1680 for LP-series PCH at stepping B, production signed and extracted, identified by code D7E83A36, probably a checksum.

Intel ME image, Corporate SKU, version 15.0.10.1447, LP platform, stepping B, production firmware, marked EXTR-Y as an extracted region with an undocumented Y flag and…

Extracted Corporate SKU ME firmware, version 15.0.10.1405, for LP chipsets at stepping B, production quality, carrying the EXTR-Y marker and hex tag 4378B856, likely a…

Corporate SKU Intel CSME region, version 15.0.2.1377, for LP chipsets at stepping B, production firmware, provided as a stock RGN image tagged 9DD33FCE, likely a…

Intel CSME 14.1.70.2228 in the Consumer low-power (LP) build, PCH stepping BA, production firmware extracted from a package, 2.84 MB, with a checksum string in the name.

Intel CSME version 14.1.53.1649, Corporate SKU for H-series PCH at A stepping, production signed, extracted, tagged -Y, 11.4 MB.

Intel CSME 14.1.53.1602, Corporate SKU for H-type PCH at A stepping, production and extracted, carrying an -N suffix instead of the -Y seen on related builds, 7.41 MB.

Intel ME 14.0.47.1558 firmware, Corporate edition for LP mobile chipsets (LP_BA), production extracted image carrying the -Y suffix, which the name leaves unexplained.

Intel ME 14.0.47.1482, Corporate SKU for LP mobile chipsets (LP_BA), production build delivered as an RGN region file of 11.4 MB.

SPI flash image for the Philco PH29E63D television, board variant A, dumped from an EN25Q32B memory chip; its 4 MB size corresponds to the 32 Mbit capacity of that…

Firmware image of 16 MB for the Compal LA-H329P motherboard, with the Management Engine region cleaned and labelled tested and working.

A 4 MB flash image tagged version V59.031 for a 1366x768 panel, with Sony remote control support built in, judging by the name.

A 4 MB flash dump labelled Sony doble 1366, apparently a Sony TV or Sony-remote board build for a 1366x768 panel; doble may mean a dual-link or double variant.

Firmware image for the Dell Inspiron N5050 fitted with a Core i3 CPU, taken from the second flash chip. It weighs 4.00 MB, so the target should be a 32 Mbit SPI device.

BIOS image for the LA-B843P laptop mainboard, a number in Compal's format, with no laptop brand specified.

Version 3 software dump for a 32 inch Philips 32PFL5237 television, carrying a star 82 vg tag in the name whose meaning is not stated.

Display EDID for a Samsung LTN140AT07 panel, revision L01, as fitted in a Lenovo Z465 notebook, 256 bytes long.

EDID dump of a Chi Mei N141I1-L03 notebook LCD, a 14.1-inch size going by Chi Mei part codes; no revision appears in the name.

EDID image for the B141XG09 V.2 14.1-inch-class XGA panel; the Chinese character in the name simply means screen, indicating a Dell display.