Version 300.2.11.1012 of an Intel Cannon Point firmware component, H chipset variant, stepping B, marked as a production build.

Version 300.1.20.1028 of a Cannon Point LP firmware module, stepping C, marked PRD for production.

A 4 KB Intel firmware module labelled CMP, version 14.5.0.1001, production build. CMP generally refers to the Comet Point chipset family, and the version format suggests…

Flash circuit for the Apple iPhone 11 Pro, packed in a 178 KB RAR archive; although catalogued as firmware, the name points to a circuit diagram, most likely of the…

ZIP archive labelled for the Redmi Note 4G, 32.9 MB, catalogued as firmware, though the name does not say whether it is a flashable image, schematic set or mixed service…

Xiaomi Redmi 1S schematic diagram and service manual, archived as a 6.06 MB RAR and filed under firmware although the name points to repair documentation.

High-resolution image set for the HP 15-af124ur motherboard, Compal board LA-C781P with project code ABL51, revision 1.0, packed as a 10.6 MB ZIP.

Tiger Point LP stepping C firmware component, version 150.1.20.1024, production signed, 152 KB in raw bin form.

Ice Lake chipset firmware module, ICP prefix, production build 130.1.30.1046 for the LP PCH with D designation.

Production firmware component 140.1.01.1005 for Intel Comet Point LP chipsets at stepping A.

Collection of PHY firmware images, a 276 KB ZIP archive labelled as a firmware repository.

Service documentation for the Xiaomi Redmi Note 4G: a schematic diagram plus service manual inside a 5.04 MB RAR archive. No board revision is noted in the name.

Documentation pack for the Xiaomi Redmi 2 containing a schematic diagram and service manual, compressed as a 1.41 MB RAR.

Intel ME 16.1.35.2557 firmware for the corporate H platform, which the name labels as prestitched, meaning a ready-made ME region rather than a raw component set.

Archive for the Xiaomi Redmi K30, named as covering both the 4G and 5G variants, in ZIP format at about 1.75 MB.

Firmware build 300.2.11.1014 for the Cannon Point H platform controller hub, B stepping, tagged PRD. CNP is the Intel code name for the 300-series chipset family.

Small 24 KB production firmware module tagged CMP_P, version 12.14.214.2014. CMP usually denotes Intel's Comet Point chipset family used with Comet Lake, and the P token…

Small CMP firmware component, production version 14.0.0.7002, only 4 KB in size. The name gives no LP or H variant and no stepping, so compatibility must be checked…

Early Apollo Lake firmware component, APL version 0.1.0.0, revision B, production build dated 2016-08-10.

Firmware dump set for the Canon G3010 ink tank printer, labelled as EEPROM data and stored in a RAR archive of about 6.4 MB.

Firmware archive labelled for a Monster HANSUNG-EH57 model tagged Boss, packed as a 4.53 MB zip.

Circuit schematic set for the Xiaomi Redmi 5, internal code name rosy, supplied as a 2.45 MB RAR archive although catalogued in the firmware section.

Service schematic for the Xiaomi Redmi Note 8, the model coded ginkgo, delivered as a 1.66 MB ZIP archive.

Circuit diagram archive for the Xiaomi Redmi 4A, code name rolex, packed in a 2.47 MB ZIP file even though the catalogue lists it under firmware.

Archive for the Xiaomi Redmi Note 4 smartphone, filed as firmware, though the name does not say what is inside.

RAR archive of 1.12 MB holding a schematic diagram and service manual for the Xiaomi Redmi Note 6 Pro.

ZIP archive of 2.28 MB named as a schematic diagram for the Xiaomi Redmi 9A, though it is catalogued as firmware; the name points to circuit diagrams rather than a flash…

Archive of 1.97 MB covering the Compal LA-9201P mainboard at revision 0.1, the earliest engineering stage.

Compal LA-D071P documentation at revision 1.0 for project AAL15, stored in a 3.24 MB RAR archive.

BIOS package for the ASUS BU201LA laptop, labelled VAS206 in the name, supplied as a zip archive of about 5.2 MB.

Intel Tiger Point (TGP) firmware module, version 150.2.10.1019, for the H-series PCH, stepping B, production signed, stored as a 152 KB bin.

Production release 9.0.2.0002 of an Ice Point (ICP) firmware component, marked with the N variant, for Intel Ice Lake platforms.

Intel Ice Lake firmware module with the ICP (Ice Point PCH) prefix, version 130.1.30.1049, LP and D tokens suggesting the low-power PCH and stepping D, production build.

Intel Gemini Lake firmware module, indicated by the GLK prefix, version 0.1.0.0 with a B token, likely the stepping, dated 2019-03-11 and marked as a production build.

An early production build, 300.1.20.1009, of the Cannon Point chipset firmware component for LP platforms at stepping C.

Firmware component for Comet Point H chipsets, stepping A, production build 140.2.01.1010.

Early production build 140.2.01.1007 of the Comet Point (CMP) chipset firmware component for H-series PCHs at stepping A.

Tiny 4 KB production firmware component for the Comet Point (CMP) family, version 140.1.00.1005, tagged V and stepping A.

Corporate edition Intel CSME, version 14.1.53.1631, for H-series PCH at A stepping, production signed and extracted, with a -Y tag the name does not explain, 11.4 MB.

Xiaomi Redmi 3s schematic collection, code name land, delivered as a fairly large 32.7 MB ZIP archive that is filed under firmware in the index.