Firmware archive labelled for the Xiaomi Redmi Note 7 smartphone, compressed into a 1.58 MB RAR.

Sony archive for the Quanta WK1 project, the board Sony labels MBX-175, marked as having no password, which suggests the extracted contents open freely rather than a…

Lenovo firmware set for the IS7XM board at revision 1.0, packed in a 7.5 MB RAR archive.

Production firmware module for the Cannon Point H PCH, stepping B, version 300.2.11.1011. Intel uses the CNP name for its 300-series chipsets.

Despite being filed as firmware, the name describes a schematic diagram for the Xiaomi Redmi Note 9 Pro, supplied as a ZIP of roughly 1.90 MB.

Schematic archive for the Xiaomi Redmi 3 handset, identified in the name by its code name ido, compressed into a 1.80 MB ZIP and catalogued under firmware.

Archive for the Compal LA-6121P motherboard, project code NCL50, UMA version, revision 1.0, in a 1.22 MB RAR file.

HP Elite x2 BIOS image in a 7.61 MB RAR, with the name pointing to an outimage file built from a COR_LP_C_NPDM_PRD_RGN Intel firmware component, suggesting a Comet…

Intel firmware module for a TGP (Tiger Point) chipset, version 150.1.20.1020, marked LP, stepping letter C and PRD for production.

Small production binary for Intel's Lakefield platform, judging by the LKF code, carrying version 13.30.0.1005.

Production firmware module for Intel Cannon Point LP, stepping C, version 300.1.20.1026, the oldest LP build in this set.

Comet Point (CMP) chipset firmware module, version 140.2.01.1018, for the H platform at stepping A, marked as a production build.

Intel APL firmware module, version 0.1.0.0, revision B, built 2017-03-24 as a production release.

RAR archive for the Xiaomi Redmi Note 6 Pro, code name tulip, marked in the name as PDF material, so it most likely holds schematic or service documentation rather than…

Repair file for the Xiaomi Redmi Note 6 Pro, filed as firmware but too small, at about 1.1 MB, to be a full flashable ROM.

Dell BIOS extraction software, identified by the name as the PFS Extractor tool, in a 55.7 KB RAR archive.

Compal LA-B181P documentation for the HP ProBook 450 G2, covering the ZPL40, ZPL50 and ZPL70 project codes, packed in a 917 KB RAR.

Production build 300.1.20.1023 of a Cannon Point (CNP) chipset firmware component for the LP, low-power mobile PCH, stepping C.

Production chipset firmware component version 300.1.11.1013 for Intel Cannon Point LP PCHs at stepping B.

Production-signed firmware component labelled CMP with version 14.0.0.1002, only 4 KB in size.

Production firmware component for the Apollo Lake platform, labelled APL with version 0.1.0.0, revision B and build date 2019-02-04.

Apollo Lake (APL) firmware component, production build from 2018-03-01, version 0.1.0.0, revision B, 64 KB in size.

Intel ME firmware region, version 16.0.0.1423, in a RAR archive of about 1.7 MB; the CON, H, A, PRD and RGN tokens read as Consumer, H-series, stepping A, production…

Schematic archive for the Xiaomi Redmi Note 5A, a phone known by the device codename ugg, packed as a 6.43 MB 7z file even though the index files it under firmware.

Circuit diagrams for the Xiaomi Redmi Note 5A, identified by the codename ugg, in a 6.54 MB ZIP archive.

BIOS package in a 3.04 MB zip archive for the Jumper EZpad 5S tablet, with the name listing the SR29Z processor stepping code, the AXP288C power management IC and the…

BIOS archive for the HP 15s-du1xxx family on Compal motherboard LA-H323P, FPW50, revision 1.0 with a 2019-01-04 date, from a board using an Intel Core i5-10210U.

Intel Cannon Point (CNP) LP firmware module at stepping C, production version 300.1.20.1015.

Production build of an Apollo Lake (APL) firmware module, version 0.1.0.0, revision B, dated 2016-07-15.

Firmware image set for revision 2.0 of the Gigabyte GA-945P-S3 motherboard, based on Intel's 945P chipset, stored in a 664 KB RAR.

Schematic archive for the Xiaomi Redmi 3S smartphone, with the code 88537 and 1.20 in the name, likely a document number and revision.

Archive for the Sony VAIO AR130 to AR320E range, built on Sony board MBX-164, which Foxconn produced under the MS21 project at revision 1.1.

Firmware module for the Intel BXT (Broxton) platform, version 0.1.0.0, revision C, dated 2017-05-30 and marked as a production PRD build.

BIOS image for the ASUS X505BP laptop mainboard, revision 2.00, packed in a 7.89 MB ZIP archive.

Production release 300.1.20.1018 of an Intel Cannon Point chipset firmware module for the LP, low-power variant at stepping C.

APL module dated 2018-11-12, version 0.1.0.0 with revision B, built as a production PRD release for Intel Apollo Lake.

Archive shared by the Sony VAIO VPC-W215A, VPC-W217JC and VPC-W211AX netbooks, all members of the VPC-W line, with the token SY3 that likely marks the board or project…

Compal LA-7987P revision 1.0 package for the Lenovo G580, G580A and G585 series, stored as a 1.20 MB RAR archive.

ZIP archive of 1.23 MB for the Xiaomi Redmi Note 4, catalogued as firmware but named as a schematic, so the actual contents should be checked after extraction.

Archive for the Xiaomi Redmi 3 smartphone, described in the name as a schematic, packed as a 1.66 MB RAR file even though it is filed under firmware.